https://givemetechnology.com/tags/semiconductor-packaging/Recent content in Semiconductor Packaging on GiveMeTechnologyHugo -- gohugo.ioen-usFri, 13 Mar 2026 15:22:11 +0000https://givemetechnology.com/2026/03/glass-substrates-could-revolutionize-ai-chip-performance/Fri, 13 Mar 2026 15:22:11 +0000https://givemetechnology.com/2026/03/glass-substrates-could-revolutionize-ai-chip-performance/What Happened Absolics, a South Korean semiconductor company, is launching commercial production of glass substrates designed specifically for AI chip packaging. These substrates, measuring 700 micrometers to 1.4mm thick, replace traditional organic materials like fiberglass-reinforced epoxy that currently serve as the foundation for connecting multiple silicon chips. The technology addresses a fundamental problem in modern computing: as AI workloads increase and chip packages grow larger, the heat generated causes traditional substrates to physically warp.